An important factor for the commercialization of the flexible electronic devices of Banner Flex Printer is the service life of the devices. The service life of the flexible electronic devices not only depends on the material and process, but also the packaging is a crucial link. Packaging not only protects devices at the physical level, but also prevents the erosion of devices by water, oxygen and corrosive liquid in the external environment.
At present, there are three common packaging methods for flexible electronics for Banner Flex Printer: thermal curing, infrared curing and ultraviolet curing, among which thermal curing and ultraviolet curing are more used.
Thermal curing and infrared curing: Most of the substrates and functional materials of flexible electronics are organic materials, and there is a glass transition temperature. The packaging temperature of flexible electronics should be considered in the process of packaging within 100-130°C, and the maximum cannot exceed 150°C. Therefore, for thermal curing and infrared curing, the maximum temperature of the device is required to be in the above range.
Ultraviolet curing: The functional layer materials of organic semiconductors are mostly conjugate structures, which may be damaged by short wavelength ultraviolet light, thus affecting the device performance. Therefore, the use of 254nm curing adhesive as packaging materials should be avoided, and the use of long wavelength curing materials should be as far as possible.
In addition, as OLED and OPV involve photoelectric conversion devices, the packaging layer also needs to ensure a certain transmittance >85%, which is conducive to the injection and injection of light.
