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Dec 20, 2022

An Introduction To The Banner Flex Printer

The Banner Flex Printer comes with three printing methods: inkjet printing, scraping and dispensing. Different printing methods correspond to different ink requirements, among which:

(1) Inkjet printing: inkjet printing for ink composition requirements are high: 1) the ink system dispersion is good enough to pass through the 0.2 micron filter head; 2) Ink viscosity between 5-25cP; 3) The surface tension should be 25-29 mNm-1.

(2) scraping: compared with inkjet printing, scraping ink parameter requirements are lower, especially the viscosity range is higher, the highest can be in 1000cP, but scraping ink surface tension and film formation has a certain need to be able to form a complete continuous and non-shrinking film on the scraping surface.

(3) Dispensing: compared with inkjet printing, scraping ink parameters are lower, especially suitable for high viscosity and large particle size printing process. Dispensing head diameter in the range of 0.06-2mm, the highest printing viscosity can be in 8000cp, can achieve dispensing printing.

Before we get to the Banner Flex Printer, let's look at flexible electronics.

Flexible electronics can be summarized as the emerging electronic technology that makes electronic devices of organic/inorganic materials on flexible/ductile plastic or thin metal substrate. With its unique flexibility, ductility, high efficiency and low cost manufacturing process, flexible electronics has a wide range of application prospects in information, energy, medical, national defense and other fields. Such as flexible electronic display, organic light-emitting diode OLED, printed RFID, thin film solar panels and so on.

As with traditional IC technology, manufacturing process and equipment are also the main driving force for the development of flexible electronics technology. The technical level index of flexible electronic manufacturing includes chip characteristic size and substrate area size. The key is how to manufacture flexible electronic devices with smaller characteristic size on the substrate with larger surface at lower cost.


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